PCBs production
- Materials: FR4, CM1, CM3, BT, halogen free and other special supports (ex. Rogers)
- Flexible, single-layer, bi-layer and multilayer up to 8 layers
- Density of tracks from class II to class V
- Surface finish: Solder coating, Electroless NI/AU, Gold/Nickel, Gold Flash, OSP Coating (organic surface protectant)
- Antisolder mask of different colors
- Components silk-screen
- Peelable ink
- Electrical test
Maximum capacities
| PCB thickness | 0.4 – 3.5mm |
| Minimum width track / gap | 0.1mm (4mil) |
| Minimum drill | 0.25mm (10mil) |
| Minimum Via / Pad | 0.4mm (16mil) |
| Maximum Pad Ratio | 12:1 |
| Maximum PCB size | 457x609mm (18×24”) |
| Tolerance diameter of the metallized drill | d ≤ 0.8 è ±0.05mm
d > 0.8 è ±0.075mm |
| Antisolder mask tolerance | ±0.05mm |
| Minimum track tolerance | ±0.1mm |
| Arched of the PCB | ≤ 0.6% |
| Tolerance in impedance control | ±0.7% |
| Insulation resistance | 1012W |
| Abrasion antisolder mask | >3H |
| Break current | 10A |
