PCBs production

  • Materials: FR4, CM1, CM3, BT, halogen free and other special supports (ex. Rogers)
  • Flexible, single-layer, bi-layer and multilayer up to 8 layers
  • Density of tracks from class II to class V
  • Surface finish: Solder coating, Electroless NI/AU, Gold/Nickel, Gold Flash, OSP Coating (organic surface protectant)
  • Antisolder mask of different colors
  • Components silk-screen
  • Peelable ink
  • Electrical test

Maximum capacities

PCB thickness 0.4 – 3.5mm
Minimum width track / gap 0.1mm (4mil)
Minimum drill 0.25mm (10mil)
Minimum Via / Pad 0.4mm (16mil)
Maximum Pad Ratio 12:1
Maximum PCB size 457x609mm (18×24”)
Tolerance diameter of the metallized drill d ≤ 0.8 è ±0.05mm

d > 0.8 è ±0.075mm

Antisolder mask tolerance ±0.05mm
Minimum track tolerance ±0.1mm
Arched of the PCB ≤ 0.6%
Tolerance in impedance control ±0.7%
Insulation resistance 1012W
Abrasion antisolder mask >3H
Break current 10A